Template and method of manufacturing semiconductor device

ABSTRACT

According to one embodiment, a template forming method is provided. In the template forming method, a template pattern is formed on a first surface of a substrate. A high liquid repellent property portion is formed in a region different from the template pattern on a side of the first surface of the substrate. The high liquid repellent property portion has a higher contacting angle with respect to a resist than a portion without the high liquid repellent property portion formed therein.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based upon and claims the benefit of priority fromJapanese Patent Application No. 2015-034019, filed on Feb. 24, 2015; theentire contents of which are incorporated herein by reference.

FIELD

Embodiments described herein relate generally to a template formingmethod, a template, and a template base material.

BACKGROUND

An imprint method for transferring a mold of an original plate to asubstrate has been given attention as a technique for forming a finepattern of a semiconductor device, and the like with high productivity.In the imprint method, a template (original plate) formed with aconcave-convex pattern (template pattern) and a resist applied on thesubstrate are brought into contact. The concave-convex pattern of thetemplate is thereby filled with resin. The template pattern istransferred to the resist on the substrate by curing the filled resist.

When the template is impressed on the resist, the resist runs out to theouter side of a template pattern region, and such run-out degrades thequality of the resist pattern.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B are cross-sectional views schematically illustrating aconfiguration example of a template according to a first embodiment;

FIGS. 2A to 2C are views describing an imprint process using thetemplate according to the first embodiment;

FIGS. 3A and 3B are cross-sectional views schematically illustrating aconfiguration example of a template base material according to the firstembodiment;

FIGS. 4A to 4C are views illustrating a production process procedure ofthe template base material according to the first embodiment;

FIGS. 5A to 5D are views illustrating a production process procedure ofa template base material according to a second embodiment;

FIGS. 6A to 6C are views illustrating a production process procedure ofa template base material according to a third embodiment;

FIGS. 7A to 7C are views illustrating a production process procedure ofa template base material according to a fourth embodiment;

FIG. 8 is a view illustrating a configuration example of a templateaccording to a fifth embodiment;

FIG. 9 is a view describing a first production process example of thetemplate according to the fifth embodiment;

FIGS. 10A and 10B are views describing a second production processexample of the template according to the fifth embodiment;

FIG. 11 is a view describing a third production process example of thetemplate according to the fifth embodiment;

FIG. 12 is a view describing a fourth production process example of thetemplate according to the fifth embodiment;

FIG. 13 is a view describing a fifth production process example of thetemplate according to the fifth embodiment;

FIG. 14 is a view illustrating a configuration example of a liquidrepellent portion according to the fifth embodiment; and

FIG. 15 is a view illustrating a configuration example of a templateaccording to a sixth embodiment.

DETAILED DESCRIPTION

Exemplary embodiments of a template forming method, a template, and atemplate base material according to an embodiment will be explainedbelow in detail with reference to the accompanying drawings. The presentinvention is not limited to the following embodiments.

According to the embodiment, a template forming method is provided. Inthe template forming method, the template pattern is formed on a firstsurface of the substrate. A high liquid repellent property portion isformed in a region different from the template pattern on a side of thefirst surface of the substrate. The high liquid repellent propertyportion has a higher contacting angle with respect to the resist than aportion without the high liquid repellent property portion formedtherein.

First Embodiment

FIGS. 1A and 1B are cross-sectional views schematically illustrating aconfiguration example of a template according to a first embodiment.Templates 10A, 10B are formed by processing a plate-shaped template basematerial.

The templates 10A, 10B according to the first embodiment each includes apedestal unit (mesa) at a central region on a front surface side (bottomsurface side in FIGS. 1A and 1B). The pedestal unit is higher than anouter peripheral region on the front surface side of the templates 10A,10B by a predetermined thickness. In the templates 10A, 10B, a templatepattern (concave-convex pattern) is formed on an upper surface side ofthe pedestal unit.

The template 10A illustrated in FIG. 1A is formed with a liquidrepellent portion 11 at the side surface of the pedestal unit. Theliquid repellent portion 11 has a higher liquid repellent property withrespect to a resist than the front surface (for example, templatepattern surface), the back surface, the side surface, or quartz of thetemplate 10A. The template 10B illustrated in FIG. 1B is formed with aliquid repellent portion 12 at the side surface of the pedestal unit andan outer peripheral region on the outer side of the pedestal unit. Theliquid repellent portion 12 has a higher liquid repellent property withrespect to a resist than the front surface (template pattern surface),the back surface, the side surface, or quartz of the template 10B.

The liquid repellent portion 11 is formed to surround the side surfaceof the pedestal unit. The liquid repellent portion 12 is formed tosurround the side surface and the outer peripheral region of thepedestal unit. The contacting angle with respect to the resist in theliquid repellent portions 11, 12 is higher than a predetermined value(e.g., 60°). The resist is a mixture having a resin (polymer), aphotosensitizing agent, an additive, and a solvent as main components.Other than a photo-polymerization initiator, the resist may include anacryl-based monomer, acrylate, and the like depending on the chemicals.

In the present embodiment, a member having a high liquid repellentproperty is arranged on at least the side surface of the pedestal unitof the front surface side of the templates 10A, 10B. According to suchconfiguration, when the templates 10A, 10B are pressed against theresist, the resist can be prevented from leaking out to the outer sideof the pedestal unit.

An imprint process using the templates 10A, 10B will now be described.The imprint processes using the templates 10A, 10B are similarprocesses, and thus the imprint process using the template 10A will bedescribed herein.

FIGS. 2A to 2C are views describing the imprint process using thetemplate according to the first embodiment. A processing film 23 isformed on a wafer 22, which is a processing substrate. A resist 25 isdropped on the processing film 23.

The imprint device (not illustrated) includes an original plate stage(template holding member) 21. As illustrated in FIG. 2A, the originalplate stage 21 fixes the template 10A at a predetermined position byvacuum adsorbing the template 10A from the back surface side of thetemplate 10A (surface on a side the template pattern is not formed)(upper surface side in FIGS. 2A to 2C).

Thereafter, the template 10A is pressed against the resist 25. Asillustrated in FIG. 2B, a distance between the template 10A and theprocessing film 23 (wafer 22) approaches a predetermined distance. Sincethe template 10A includes the liquid repellent portion 11, the resist 25can be suppressed from running out from the pedestal unit, which is aforming region of the template pattern, when the template 10A is pressedagainst the resist 25. The resist 25 is filled in the template patternby bringing the template 10A and the resist 25 into contact for apredetermined time.

When the template 10A is irradiated with a UV light in this state, theresist 25 is irradiated with the UV light and the resist 25 is cured asa result. A transfer pattern corresponding to the template pattern isthereby patterned on the resist 25 on the wafer 22. Subsequently, asillustrated in FIG. 2C, the template 10A is pulled away from the resist25.

Therefore, in the present embodiment, the template 10A includes theliquid repellent portion 11. Thus, when the template 10A is impressed onthe resist 25, the resist 25 is less likely to ride over the liquidrepellent portion 11. The run-out of the resist 25 from the templatepattern thus can be suppressed. Therefore, the template 10A can beprevented from riding on the cured resist 25 in the imprint process toan adjacent shot. As a result, the breakage of the template 10A can beprevented. Furthermore, the degradation in the quality of the resistpattern can be prevented since the run-out of the resist 25 can besuppressed.

The liquid repellent portions 11, 12 may be formed before forming thetemplate pattern, or may be formed after forming the template pattern.If the liquid repellent portions 11, 12 are formed before forming thetemplate pattern, the liquid repellent portions 11, 12 are formed withrespect to the template base material.

FIGS. 3A and 3B are cross-sectional views schematically illustrating aconfiguration example of the template base material according to thefirst embodiment. Template base materials 11A, 11B are substrates beforethe template pattern is formed.

The template base materials 11A, 11B according to the first embodimentinclude the pedestal unit at the central region on the front surfaceside (bottom surface side in FIGS. 3A and 3B). The pedestal unit ishigher than the outer peripheral region on the front surface side of thetemplate base materials 11A, 11B by a predetermined thickness. The uppersurface side of the pedestal unit is the region where the templatepattern is formed.

The template base material 11A illustrated in FIG. 3A is formed with theliquid repellent portion 11 at the side surface of the seat unit. Theliquid repellent portion 11 has a higher liquid repellent property withrespect to a resist than the upper surface of the seat unit, and theback surface, the side surface, or quartz of the template base material11A. The template base material 11B illustrated in FIG. 3B is formedwith the liquid repellent portion 12 at the side surface of the seatunit and the outer peripheral region on the outer side of the seat unit.The liquid repellent portion 12 has a higher liquid repellent propertywith respect to a resist than the upper surface of the seat unit, andthe back surface, the side surface, or quartz of the template basematerial 11A.

In the present embodiment, a member having a high liquid repellentproperty is arranged on at least the side surface of the pedestal unitof the front surface side of the template base materials 11A, 11B.According to such configuration, the templates 10A, 10B can be producedby forming the template pattern in the template base materials 11A, 11B.As a result, the resist 25 can be prevented from leaking out to theouter side of the pedestal unit when the templates 10A, 10B are pressedagainst the resist 25.

Next, a method for producing the templates 10A, 10B and the templatebase materials 11A, 11B will be described. The production processes ofthe templates 10A, 10B, and the template base materials 11A, 11B aresimilar processes, and thus the production method of the template basematerial 11B will be described herein.

FIGS. 4A to 4C are views illustrating a production process procedure ofthe template base material according to the first embodiment. A spotfacing processing is carried out on the back surface side of the regionto be formed with the template pattern with respect to a quartz glasssubstrate (flat plate). Furthermore, the pedestal unit is formed withrespect to the quartz glass substrate. The quartz glass substrate is asubstrate 30 before the liquid repellent portion 12 is formed.

Thereafter, as illustrated in FIG. 4A, a protecting portion 31 is formedon the pedestal unit with respect to the substrate 30. The protectingportion 31 is formed using a chemical having a high liquid repellentproperty (weak adhesiveness), and the like with respect to the quartzglass substrate. The protecting portion 31 protects the template patternregion (upper surface of pedestal unit) from the chemicals used to formthe liquid repellent portion 12. The protecting portion 31 is formed inthe template pattern region where the liquid repellent portion 12 is notto be formed.

When forming the protecting portion 31, the chemicals having a highliquid repellent property with respect to the substrate 30 is attachedto the region (upper surface of pedestal unit) to form the protectingportion 31 in the substrate 30. The chemical is a chemical containingsilane such as silane coupling agent, and the like.

The substrate 30 formed with the protecting portion 31 is exposed to anatmosphere of a chemical 16 having a high liquid repellent property withrespect to the resist 25. The chemical 16 is, for example, a fluorinatedsolvent such as perfluoropolyether (PEPE), and the like. The chemical 16is, for example, a 20% liquid solution of water repellent coating agentin which the undiluted solution of a water repellent coating agent isdiluted with a solvent.

When forming the liquid repellent portion 12, the substrate 30 isarranged such that the chemical 16 and the upper surface of the pedestalunit face each other. The chemical 16 is then heated to evaporate thechemical 16. The evaporated chemical 16 thereby attaches to the sidesurface of the pedestal unit and the outer peripheral region on theouter side of the pedestal unit to form the liquid repellent portion 12,as illustrated in FIG. 4B. Thereafter, as illustrated in FIG. 4C, theprotecting portion 31 is removed from the substrate 30, whereby thesubstrate 30 becomes the template base material 11B.

The protecting portion 31 may be formed by attaching a protective filmsuch as a resin film, and the like. The protecting portion 31 may be ametal film or a semiconductor film. In this case, the metal film or thesemiconductor film is formed on the upper surface of the pedestal unitto form the protecting portion 31. The protecting portion 31 may be ashielding member. In this case, the protecting portion 31 serving as theshielding member is proximately arranged with respect to the patternsurface, and then the substrate 30 is exposed to the atmosphere of thechemicals 16. A hard mask thus protects the upper surface of thepedestal unit from the chemical 16, and the chemical 16 attaches to theside surface of the pedestal unit and the outer peripheral region on theouter side of the pedestal unit to become the liquid repellent portion12. Furthermore, when forming the liquid repellent portion 12, theprotecting portion 31 is arranged on the substrate 30, and then thesubstrate 30 may be immersed in the chemical 16.

Therefore, according to the first embodiment, the template pattern isformed on the template pattern surface on the front surface of thesubstrate 30. The liquid repellent portions 11, 12 are formed in regionsdifferent from the template pattern surface. The liquid repellentportions 11, 12 have a higher contacting angle than the front surface(for example, template pattern surface), the back surface, the sidesurface, or quartz of the substrate 30. Therefore, when the templates10A, 10B are impressed on the resist 25, the resist 25 is repelled bythe liquid repellent portions 11, 12. The run-out of the resist 25 whenthe templates 10A, 10B are impressed on the resist 25 thus can besuppressed. AS a result, the desired resist pattern can be formed, andthe breakage of the templates 10A, 10B can be prevented.

Second Embodiment

A second embodiment will now be described using FIGS. 5A to 5D. In thesecond embodiment, the protecting portion 31 and the liquid repellentportion 12 are formed through a method similar to the first embodiment.The protecting portion 31 is removed by carrying out RIE (Reactive IonEtching).

FIGS. 5A to 5D are views illustrating a production process procedure ofa template base material according to the second embodiment. Among theprocesses illustrated in FIGS. 5A to 5D, the description on theprocesses similar to the first embodiment will be omitted. The substrate30 illustrated in FIG. 5C is turned upside down from the substrate 30illustrated in FIG. 5B.

In the second embodiment, the spot facing processing and the formationof the pedestal unit are carried out with respect to the quartz glasssubstrate, similar to the first embodiment. The quartz glass substratethus becomes the substrate 30 before the liquid repellent portion 12 isformed.

Thereafter, the protecting portion 31 is formed on the pedestal unit, asillustrated in FIG. 5A, with respect to the substrate 30. As illustratedin FIG. 5B, the evaporated chemical 16 attaches to the side surface ofthe pedestal unit and the outer peripheral region on the outer side ofthe pedestal unit to become the liquid repellent portion 12.

Thereafter, as illustrated in FIG. 5C, the liquid repellent portion 12is covered with a protective film 45. The RIE is carried out from abovethe protecting portion 31 to remove the protecting portion 31 from thesubstrate 30. Thereafter, the protective film 45 is removed from thesubstrate 30. Thus, the substrate 30 becomes the template base material11B, as illustrated in FIG. 5D.

The protecting portion 31 may be removed using a liquid (solvent) suchas a thinner, and the like in place of the RIE. When forming the liquidrepellent portion 12, the protecting portion 31 may be arranged on thesubstrate 30, and then the substrate 30 may be immersed in the chemical16.

Therefore, according to the second embodiment, the protecting portion 31is removed using the RIE or the liquid such as the thinner, and thelike, whereby the protecting portion 31 can be easily and accuratelyremoved when producing the template base material 11B.

Third Embodiment

A third embodiment will now be described using FIGS. 6A to 6C. In thethird embodiment, the upper surface and the side surface of the pedestalunit and the outer peripheral region on the outer side of the pedestalunit are covered with the chemical 16, from which the liquid repellentportion 12 is formed. The chemical 16 on the pedestal unit is thenremoved.

FIGS. 6A to 6C are views illustrating a production process procedure ofa template base material according to the third embodiment. Among theprocesses illustrated in FIGS. 6A to 6C, the description on theprocesses similar to the first and second embodiments will be omitted.The substrate 30 illustrated in FIG. 6B is turned upside down from thesubstrate 30 illustrated in FIG. 6A.

In the third embodiment, the spot facing processing and the formation ofthe pedestal unit are carried out with respect to the quartz glasssubstrate, similar to the first embodiment. The quartz glass substratethereby becomes the substrate 30 before the liquid repellent portion 12is formed.

When forming the liquid repellent portion 12, the substrate 30 isarranged such that the chemical 16 and the upper surface of the pedestalunit face each other. In other words, the upper surface of the pedestalunit is brought into contact with the chemical 16. The chemical 16 isthen heated to evaporate the chemical 16.

As illustrated in FIG. 6A, the evaporated chemical 16 attaches to theupper surface and the side surface of the pedestal unit and the outerperipheral region on the outer side of the pedestal unit. In otherwords, the evaporated chemical 16 attaches to the front surface (surfaceon the side formed with the pedestal unit) of the substrate 30.

As a result, the chemical 16 attached to the side surface of thepedestal unit and the outer peripheral region on the outer side of thepedestal unit becomes the liquid repellent portion 12, and the chemical16 attached to the upper surface of the pedestal unit becomes a liquidrepellent portion 32. The liquid repellent portion 32 is a film formedat a position similar to the protecting portion 31.

Thereafter, as illustrated in FIG. 6B, the liquid repellent portion 12is covered with the protective film 45. The RIE is carried out fromabove the liquid repellent portion 32 to remove the liquid repellentportion 32 from the substrate 30. Thereafter, the protective film 45 isremoved from the substrate 30. Thus, as illustrated in FIG. 6C, thesubstrate 30 becomes the template base material 11B. The liquidrepellent portion 32 may be removed using a liquid (solvent) such asthinner, and the like in place of the RIE.

Therefore, according to the third embodiment, the liquid repellentportion 32 is formed on the pedestal unit using the chemical 16, so thatthe liquid repellent portion 12 and the liquid repellent portion 32,which is a substitute of the protecting portion 31, can besimultaneously formed. The upper surface of the pedestal unit thus canbe easily covered. Therefore, the template base material 11B can beeasily produced.

Fourth Embodiment

A fourth embodiment will now be described using FIGS. 7A to 7C. In thefourth embodiment, the front surface of the substrate 30 is immersed ina liquid (solvent 17 to be hereinafter described) similar to thechemical 16. The upper surface and the side surface of the pedestal unitand the outer peripheral region on the outer side of the pedestal unitare thereby covered with the film of the fluid 17. Thereafter, the filmon the pedestal unit is removed.

FIGS. 7A to 7C are views illustrating a production process procedure ofa template base material according to the fourth embodiment. Among theprocesses illustrated in FIGS. 7A to 7C, the description on theprocesses similar to the first to third embodiments will be omitted. Thesubstrate 30 illustrated in FIG. 7B is turned upside down from thesubstrate 30 illustrated in FIG. 7A.

In the fourth embodiment, the spot facing processing and the formationof the pedestal unit are carried out with respect to the quartz glasssubstrate, similar to the first embodiment. Thus, the quartz glasssubstrate becomes the substrate 30 before the liquid repellent portion12 is formed.

In the present embodiment, the liquid chemical 17 having a componentsimilar to the chemical 16 is used. As illustrated in FIG. 7A, thechemical 17 is stored in a liquid tank 50, and the substrate 30 isimmersed in the liquid tank 50. Specifically, the substrate 30 isarranged in a direction in which the chemical 17 and the upper surfaceof the pedestal unit face each other. The front surface of the substrate30 is then immersed in the chemical 17. The chemical 17 thereby attachesto the upper surface and the side surface of the pedestal unit and theouter peripheral region on the outer side of the pedestal unit. In otherwords, the liquid chemical 17 attaches to the front surface of thesubstrate 30.

As a result, the chemical 17 attached to the side surface of thepedestal unit and the outer peripheral region on the outer side of thepedestal unit becomes the liquid repellent portion 12, and the chemical17 attached to the upper surface of the pedestal unit becomes the liquidrepellent portion 32. Thereafter, as illustrated in FIG. 7B, the liquidrepellent portion 12 is covered with the protective film 45. The RIE isthen carried out from above the liquid repellent portion 32 to removethe liquid repellent portion 32 from the substrate 30. Thereafter, theprotective film 45 is removed from the substrate 30. Thus, asillustrated in FIG. 7C, the substrate 30 becomes the template basematerial 11B. The liquid repellent portion 32 may be removed using aliquid (solvent) such as thinner, and the like in place of the RIE.

The protecting portion 31 may be provided at a position to form theliquid repellent portion 32. In this case, the upper surface of thepedestal unit does not make contact with the chemical 17, and thus theliquid repellent portion 32 is not formed on the upper surface of thepedestal unit. Therefore, the protecting portion 31 is removed insteadof removing the liquid repellent portion 32. Furthermore, the protectingportion 31 may be a protective film such as a resin film, or a metalfilm or a semiconductor film. The liquid repellent portions 12, 32 maybe formed by vapor deposition described in the first embodiment.

According to the fourth embodiment, the liquid repellent portion 32 isformed on the pedestal unit using the chemical 17, so that the liquidrepellent portion 12 and the liquid repellent portion 32, which is asubstitute of the protecting portion 31, can be simultaneously formed.The upper surface of the pedestal unit thus can be easily covered.Therefore, the template base material 11B can be easily produced.

Fifth Embodiment

A fifth embodiment will now be described using FIGS. 8 to 14. In thefifth embodiment, concave portions and convex portions are formed on theside surface of the seat unit. The liquid repellent property of the sidesurface of the seat unit with respect to the resist 25 thus becomeshigher than the liquid repellent property of the front surface (forexample, template pattern surface), the back surface, the side surface,or quartz of the template.

FIG. 8 is a view illustrating a configuration example of a templateaccording to the fifth embodiment. In FIG. 8, the cross-sectional shapeof one part of a template 10C is schematically illustrated. The template10C is formed by scraping the template base material. The template 10Caccording to the fifth embodiment includes a pedestal unit at thecentral region on the front surface side.

The template 10C is formed with a liquid repellent portion 13 on theside surface of the seat unit. The liquid repellent portion 13 has ahigher liquid repellent property with respect to the resist 25 than thefront surface (for example, template pattern surface), the back surface,the side surface, or quartz of the template 10C. The liquid repellentportion 13 is formed to surround the side surface of the seat unit. Theliquid repellent portion 13 has a higher contacting angle with respectto the resist 25 than a predetermined value (e.g., 60°). The liquidrepellent portion 13 has a concave-convex structure, so that the liquidrepellent property with respect to the resist 25 is enhanced by thelotus effect. The concave-convex structure may have a shape in which aconcave portion and a convex portion are repeatedly lined at apredetermined period in a two-dimensional direction, or may have a shapein which such portions are unevenly lined.

In the present embodiment, a member having a high liquid repellentproperty is arranged on at least the side surface of the pedestal unitof the front surface side of the template 10C. According to suchconfiguration, when the template 10C is pressed against the resist 25,the resist 25 can be prevented from leaking out to the outer side of thepedestal unit.

Next, a method for producing the template 10C will be described. FIG. 9is a view describing a first production process example of the templateaccording to the fifth embodiment. In the substrate 30, an area otherthan the side surface of the pedestal unit is covered in advance with aprotective film 70 (not illustrated), and the like. When the sidesurface of the pedestal unit is subjected to wet etching in such astate, the concave-convex structure (liquid repellent portion 13) isformed on the side surface of the pedestal unit. HF (hydrofluoric acid),alkaline liquid 61, and the like are used, for example, for the wetetching herein. Thereafter, the protective film 70 is removed from thesubstrate 30, and the template pattern is formed on the pedestal unit,whereby the substrate 30 becomes the template 10C.

FIGS. 10A and 10B are views describing a second production processexample of the template according to the fifth embodiment. In thesubstrate 30, an area other than the side surface of the pedestal unitis covered in advance with the protective film 70, and the like. An ion62 such as Sb (antimony), and the like is ion implanted to the sidesurface of the pedestal unit in such a state. The substrate 30 thusbecomes a state in which the Sb is injected to the side surface of thepedestal unit.

Thereafter, the side surface of the pedestal unit is subjected to thewet etching with respect to the substrate 30, so that the concave-convexstructure (liquid repellent portion 13) is formed on the side surface ofthe pedestal unit. An alkaline liquid 63, and the like, for example, isused for the wet etching. The protective film 70 is then removed fromthe substrate 30 and the template pattern is formed on the pedestalunit, whereby the substrate 30 becomes the template 10C.

FIG. 11 is a view describing a third production process example of thetemplate according to the fifth embodiment. In the substrate 30, an areaother than the side surface of the pedestal unit is covered in advancewith the protective film 70, and the like. A DSA (DirectedSelf-Assembly) material 64 is applied to the side surface of thepedestal unit in such a state. The DSA material 64 is, for example, ablock copolymer containing material containing block copolymer (BCM) ora polymer mixed material containing a plurality of polymers.

When the substrate 30 applied with the DSA material 64 is subjected toannealing, the DSA material 64 self-organizes. A hydrophilic part and alipophilic part contained in the DSA material 64 thereby gather togetheraccording to a predetermined rule. When the DSA material 64 isself-organized, the concave-convex structure (liquid repellent portion13) forms on the side surface of the pedestal unit in the substrate 30.Thereafter, the protective film 70 is removed from the substrate 30, andthe template pattern is formed on the pedestal unit, whereby thesubstrate 30 becomes the template 10C. The guide pattern may be formedon the side surface of the pedestal unit before the DSA material 64 isapplied.

FIG. 12 is a view describing a fourth production process example of thetemplate according to the fifth embodiment. When producing the template100, the DSA material 64 is applied to a predetermined sheet. The sheetapplied with the DSA material 64 is subjected to annealing, and the DSAmaterial 64 self-organizes. Thereafter, a sheet 65 (liquid repellentportion 13) in which the DSA material 64 is self-organized is attachedto the side surface of the pedestal unit of the substrate 30.Subsequently, the protective film 70 is removed from the substrate 30and the template pattern is formed on the pedestal unit, whereby thesubstrate 30 becomes the template 100.

The template 100 may be such that either one of the hydrophilic part orthe lipophilic part of after the DSA material 64 is self-organized isremoved. The template 100 may be such that either one of the hydrophilicpart or the lipophilic part is removed without self-organizing the DSAmaterial 64. Furthermore, the template 100 may be such that the liquidrepellent process is performed on the DSA material 64 after the DSAmaterial 64 is self-organized.

FIG. 13 is a view describing a fifth production process example of thetemplate according to the fifth embodiment. The side surface of thepedestal unit is subjected to mechanical polishing by a working head 46with respect to the substrate 30. The concave-convex structure (liquidrepellent portion 13) forms on the side surface of the pedestal unit bythe mechanical polishing. Thereafter, the protective film 70 is removedfrom the substrate 30, and the template pattern is formed on thepedestal unit, whereby the substrate 30 becomes the template 100.

FIG. 14 is a view illustrating a configuration example of the liquidrepellent portion according to the fifth embodiment. In FIG. 14, the topview of the liquid repellent portion 13 is illustrated. The liquidrepellent portion 13 has a shape, for example, in which a convex portion71 and a concave portion 72 are repeatedly lined at a predeterminedperiod in the two-dimensional direction. In the liquid repellent portion13, for example, the area of the convex portion 71 is narrower than thearea of the concave portion 72.

The liquid repellent portion 13 may be arranged with respect to thesubstrate 30 of after the template pattern is formed. In other words,the template pattern may be formed before the liquid repellent portion13. In this case as well, the substrate 30 is formed with the liquidrepellent portion 13 through a method similar to the template 10C.

According to the fifth embodiment, the template 10C can be easily formedsince the liquid repellent portion 13 is formed using the wet etching,the ion implantation, and the like.

Sixth Embodiment

A sixth embodiment will now be described using FIG. 15. In the sixthembodiment, the liquid repellent portion is arranged on the templatethat does not include the pedestal unit.

FIG. 15 is a view illustrating a configuration example of a templateaccording to the sixth embodiment. A template 10D is formed by scrapingthe template base material. The template 10D according to the sixthembodiment does not include the seat unit. In the template 10D, thetemplate pattern is formed in the central region on the front surfaceside. The template 10D is formed with a liquid repellent portion 14 inthe outer peripheral region on the outer side of the pattern formingregion where the template pattern is formed. The liquid repellentportion 14 has a higher liquid repellent property with respect to theresist 25 than the front surface (pattern forming region), the backsurface, the side surface, or quartz of the template 10D.

When forming the template 10D, the outer peripheral region on the sideof the front surface of the quartz glass substrate is scraped. The platethickness of the outer peripheral region thus becomes thinner than thecentral region. Furthermore, the template pattern is formed in thecentral region on the side of the front surface of the quartz glasssubstrate. Moreover, the liquid repellent portion 14 is formed in theouter peripheral region on the side of the front surface of the quartzglass substrate. The liquid repellent portion 14 merely needs to beformed in the vicinity of the border of the central region and the outerperipheral region. The liquid repellent portion 14 is formed through themethods described in the first to fifth embodiments.

Either one of the formation of the template pattern and the formation ofthe liquid repellent portion 14 may be carried out first. Either one ofthe formation of the template pattern and the cutting of the outerperipheral region may be carried out first.

The templates 10A to 10D described in the first to sixth embodiments areused in the lithography step of when manufacturing a semiconductordevice (semiconductor integrated circuit). The lithography is carriedout for every layer of the wafer process, for example. Specifically, oneof the templates 10A to 10D is produced in advance. The imprint processis carried out with one of the templates 10A to 10D on the wafer appliedwith the resist 25. In the imprint process, for example, the resist 25is patterned through a step and repeat method (repetition of impressingand separation with respect to resist 25). Thereafter, the lower layerside of the resist pattern is etched. The actual pattern correspondingto the template pattern is thereby formed on the wafer. Whenmanufacturing the semiconductor device, the production process of thetemplates 10A to 10D, the imprint process, the etching process, and thelike are carried out for every layer.

According to the sixth embodiment, the run-out of the resist 25 when thetemplate 10D is impressed on the resist 25 can be suppressed, similar tothe first embodiment. As a result, the desired resist pattern can beformed and the breakage of the template 10D can be prevented.

While certain embodiments have been described, these embodiments havebeen presented by way of example only, and are not intended to limit thescope of the inventions. Indeed, the novel embodiments described hereinmay be embodied in a variety of other forms; furthermore, variousomissions, substitutions and changes in the form of the embodimentsdescribed herein may be made without departing from the spirit of theinventions. The accompanying claims and their equivalents are intendedto cover such forms or modifications as would fall within the scope andspirit of the inventions.

1-20. (canceled)
 21. A template comprising: a pedestal region providedon a first surface of a first substrate, the pedestal region being aregion to which a template pattern is to be formed; and a liquidrepellent portion formed on a side wall of the pedestal region, theliquid repellent portion having a concave-convex surface.
 22. Thetemplate according to claim 21, wherein the liquid repellent portion hasa higher contacting angle with respect to a resist to which the templatepattern is to be transferred than a portion without the liquid repellentportion.
 23. The template according to claim 21, wherein the liquidrepellent portion is formed on a region on an outer side of the pedestalregion.
 24. The template according to claim 21, wherein a height of aconvex portion of the liquid repellent portion is lower than a height ofthe template pattern.
 25. The template according to claim 21, wherein aconvex portion of the liquid repellent portion is a same member as anend portion of the first substrate.
 26. The template according to claim21, wherein an upper surface area of a convex portion of the liquidrepellent portion is smaller than a bottom surface area of a concaveportion of the liquid repellent portion.
 27. The template according toclaim 26, wherein the liquid repellent portion repels a resist by lotuseffect.
 28. The template according to claim 21, wherein a convex portionof the liquid repellent portion consists of a single material.
 29. Thetemplate according to claim 21, wherein an area of a convex portion ofthe liquid repellent portion becomes smaller as a distance from thefirst substrate increases.
 30. The template according to claim 21,wherein a space between convex portions of the liquid repellent portionis smaller than pattern dimensions of the template pattern.
 31. Atemplate comprising: a template pattern arranged on a first surface of afirst substrate; and a liquid repellent portion formed in a regiondifferent from a region to which the template pattern is arranged, theliquid repellent portion having a higher contacting angle with respectto a resist than a portion without the liquid repellent portion formedtherein.
 32. A method of manufacturing a semiconductor devicecomprising: forming a processing film on a semiconductor substrate;providing a resist on the processing film; pressing a first surface of atemplate against the resist, the template having a pedestal region and aliquid repellent portion, the pedestal region being provided on a firstsurface of a first substrate, the liquid repellent portion being formedon a side wall of the pedestal region, the pedestal region being aregion to which a template pattern is to be formed, the liquid repellentportion having a concave-convex surface; filling the template patternwith the resist; curing the resist; separating the template from theresist; and etching the processing film by using a resist pattern as amask.
 33. The method of manufacturing the semiconductor device accordingto claim 32, wherein the liquid repellent portion has a highercontacting angle with respect to a resist to which the template patternis to be transferred than a portion without the liquid repellentportion.
 34. The method of manufacturing the semiconductor deviceaccording to claim 32, wherein the liquid repellent portion is formed ona region on an outer side of the pedestal region.
 35. The method ofmanufacturing the semiconductor device according to claim 32, wherein aheight of a convex portion of the liquid repellent portion is lower thana height of the template pattern.
 36. The method of manufacturing thesemiconductor device according to claim 32, wherein a convex portion ofthe liquid repellent portion is a same member as an end portion of thefirst substrate.
 37. The method of manufacturing the semiconductordevice according to claim 32, wherein an upper surface area of a convexportion of the liquid repellent portion is smaller than a bottom surfacearea of a concave portion of the liquid repellent portion.
 38. Themethod of manufacturing the semiconductor device according to claim 37,wherein the liquid repellent portion repels a resist by lotus effect.39. The method of manufacturing the semiconductor device according toclaim 32, wherein a convex portion of the liquid repellent portionconsists of a single material.
 40. The method of manufacturing thesemiconductor device according to claim 32, wherein an area of a convexportion of the liquid repellent portion becomes smaller as a distancefrom the first substrate increases.